Paras Semiconductors Signs BroadPak Deal to Bring 3D Chip Packaging to India

Under the agreement, Paras will get access to BroadPak's design, manufacturing and integration intellectual property, along with technology transfer and process know-how in 2.5D and 3D packaging and chiplet integration. The two companies will also explore jointly developing packaging platforms for artificial intelligence and high-performance computing, and training Indian engineers.

Advanced packaging, which stacks or links several chips in one module, has become a bottleneck in supplying AI processors, and India has few domestic facilities able to do the most complex forms of it. Paras said it aims to set up an outsourced semiconductor assembly and test, or OSAT, facility focused on heterogeneous integration and 3D packaging. The planned work covers hybrid bonding, wafer- and panel-level fan-out packaging, co-packaged optics, and advanced testing and qualification, aimed at high-volume production of chips for optical and optronic systems as well as high-performance computing, networking and data centres.

BroadPak, headquartered in San Jose, California, and founded in 2007, describes itself as a provider of 2.5D and 3D integration technologies.

Munjal Sharad Shah, managing director of Paras Defence & Space Technologies, said the company's "entry into the semiconductor sector represents a strategic expansion into a technology domain" and that BroadPak "brings the specialised technology expertise required to accelerate this ambition." Farhang Yazdani, BroadPak's founder and chief executive, said the company looked forward to bringing its advanced packaging expertise to the partnership.

The statement did not give financial terms, a timeline or a site for the facility. In July, Paras Semiconductors signed a memorandum of understanding with the Madhya Pradesh government's science and technology department for a greenfield OSAT plant in the Indore-Ujjain region, with a proposed investment of ₹62 billion, about $644 million, according to Evertiq, citing Reuters. The companies have not said whether the BroadPak partnership is tied to that project.